01
Problem
Early ICT fixture prototypes risked excessive PCBA strain during vacuum actuation, creating potential latent damage to solder joints and brittle components.
02
Constraints
- Fixture design had to maintain electrical contact while limiting board deformation.
- High-density probe fields and support pins created competing mechanical constraints.
- Strain limits had to be defensible against recognized electronics assembly expectations.
- The solution had to preserve test throughput.
03
Engineering Decisions
- Mapped strain-sensitive areas and fixture contact points.
- Adjusted support-pin layout to distribute vacuum-actuation loads.
- Reviewed probe placement and mechanical constraints together instead of independently.
- Used design feedback to improve fixture life and product reliability.
04
Validation
- Compared strain risk before and after fixture support changes.
- Verified test contact reliability after mechanical optimization.
- Reviewed failure-risk areas for capacitors, BGA locations, and solder joints.
05
Risk & Mitigation
- Excessive board strain could create micro-fractures; mitigated through support layout changes.
- Reduced strain could compromise probe contact; mitigated through combined electrical/mechanical verification.
- Fixture wear could reintroduce loading issues; mitigated through maintenance and inspection criteria.
06
Outcome
The fixture design was improved to reduce product damage risk while maintaining test functionality and production throughput.